The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages download pdf
Par sweatman dave le jeudi, février 22 2018, 01:07 - Lien permanent
Gerard Kelly: The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages
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Author: Gerard Kelly
Number of Pages: 153 pages
Published Date: 08 Oct 2012
Publisher: Springer-Verlag New York Inc.
Publication Country: New York, NY, United States
Language: English
ISBN: 9781461372769
Download Link: Click Here
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